Heavy Cut Polishing Cream As 30 – 1 Kg 14992.205.001

Categories , Tag Brand:

Description

Product Information

  • Manufacturer: Menzerna
  • Product Name: AS 30 Polishing Compound
  • Part Number: 14992.205.001
  • Volume / Weight: 1 kg bottle
  • Country of Manufacture: Germany
  • Silicone Content: Silicone-free
  • Base: Water-based formula

 

Menzerna AS 30 Polishing Compound

Product Description
Menzerna AS 30 is a high-performance polishing compound designed to effectively remove overspray, heavy wear marks, and sanding scratches. It delivers reliable correction results while maintaining a smooth finish.

This polishing compound is especially suitable for fresh and soft clear coat surfaces. The formula is water-based and silicone-free, making it ideal for professional automotive refinishing and body shop applications.

Application Instructions

  1. Surface Preparation
    Ensure the surface is clean and free from dust, grease, or contaminants before polishing.
  2. Product Preparation
    Shake the bottle well before use.
  3. Recommended Quantity (for a 40 cm × 40 cm working area)
    • 95 mm pad: Apply 3–4 pea-sized drops
    • 150 mm pad: Apply 5 pea-sized drops
    • 180 mm pad: Apply 6–7 pea-sized drops
  4. Pad Selection
    • For heavy defects: use Menzerna Heavy Cut Foam Pad or Lambswool Pad
    • For rotary polishing machines: Menzerna Standard Lambswool Pad
    • For orbital polishing machines: Menzerna Orbital Wool Pad
  5. Polishing Process
    • Use either a rotary or orbital polishing machine.
    • Apply the cross-coating method while polishing.
    • Maintain strong, even pressure and start with a low machine speed to spread the product evenly.
  6. Polish Behaviour
    The compound will initially appear milky. Continue polishing until it turns into a slightly transparent, oily film, indicating the polishing cycle is complete.

 

Reviews

There are no reviews yet.

Be the first to review “Heavy Cut Polishing Cream As 30 – 1 Kg 14992.205.001”

Your email address will not be published. Required fields are marked *